ProtectoXP lacquering offers optional 2K encapsulation.

Camstar Electronics Suite manufacturing execution system (MES) enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.

Aquanox A4727 is has a stable pH and predictable compatibility throughout its long bath life.

LED405Med one-component, LED-curing adhesive meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.

Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.

Master Bond Supreme 11HT-3A two-part, room-temperature curing epoxy is said to have reliable thermal cycling abilities and high-temperature resistance.

MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.

TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".

Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.

Flexline software is for accurate slide line/assembly documentation.

Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.

G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.