SIM8055 nano SIM connector includes a card detection switch.

Select-10 is now available as a flux-pen. Is a zero-halogen no-clean liquid flux designed specifically for selective soldering process.

These 0.8mm free height board-to-board connectors achieve speeds of 32Gbps and higher.

Aqube MV8 sTwin stencil cleaning system features dual-process chambers with independent operating control.

Seven new ergonomic handpieces complement Connection Validation (CV) soldering system.

This automated coating inspection line combines Select Coat SL-940 conformal coating system with FX-940UV series ACI/AOI automated conformal coat inspection system.

Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.

PF606-PW215 water-soluble solder paste provides high-speed printability that reportedly produces great solder paste print quality, as well as a wide reflow process window for excellent solderability.

Sarcon 15GTR is a thin thermal interface composite film made from heat-conducting silicone and a 0.05mm fiberglass reinforcement layer.

Pen-Vac Kit is self-contained with eight probes plus cups and vacuum pen holder.

Scanflex II Cube JTAG/boundary scan controller has an optional Wireless LAN interface.

Master Bond EP21ND-LP two-part epoxy is for structural bonding applications involving large surface areas.