Vantage network software provides a real-time dashboard for thermal processes, accessible anywhere, from any authorized PC or mobile device.

Omegameter SMD 650 software-controlled ionic contamination test system identifies the presence of ionic contamination on bare and assembled printed circuit boards and other electronic components.

PrinTEK AP-3624-V benchtop large-area stencil printer has a 32” x 24”print area (813mm x 610mm), a load-unload-reload repeatability of better than +/-1 mil (0.001"), and has optional vision for precision setup.

268 flux-cored wire is zero-halogen and optimized for robotic soldering. Is said to provide consistent workability performance for both robotic and manual soldering, with performance equivalent to conventional halogen-/halide-based systems.

Master Bond EP110F8-5 potting, sealing, encapsulation and casting epoxy is dimensionally stable and has low shrinkage upon cure.

Alpha Sn42 Bi57.6 Ag0.4 lead-free solid solder wire is primarily for rework operations and touchup soldering of low-temperature-based electronic assemblies.

Revision F IPC-JSTD-001 training kit is used in IPC training classes for certification.

Particle Impact Dampers reduce random vibration in PCB assemblies in harsh environments.

3D Planner virtually simulates the inspection process and evaluates a range of inspection scenarios offline.

XJTAG v3.6 includes several new productivity and automation-focused enhancements, for setting up tests for complex boards in significantly less time.

Sarcon EGR-11F thermal interface material absorbs a range of unwanted electromagnetic energy.

SQ3000 3D CMM (coordinate measurement) system is powered by multi-reflection suppression (MRS) technology and CyberCMM, new software for coordinate measurement.