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Sherlock automated design analysis software v. 5.3 now features thermal-mechanical analysis, which provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

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PF606-P140 lead-free solder paste offers continuous high-speed printability and a wide reflow process window.

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BotFactory SV2 is a desktop machine designed to print and assemble printed circuit boards on rigid or flexible materials directly from digital PCB layout tools.

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Lord SC-800 UV cure silicone is a one-component, noncorrosive sealant designed to provide a flexible form-in-place gasket cured in place with UV light.

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ESD-Safe films, tapes and labels protect ESD-sensitive (ESDS) devices.

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Direct Connect Horizontal (DCH) high-speed press-fit twinax cable assembly targets high-performance flyover or coplanar right angle and parallel board-to-board applications.

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ISO-Spector S2 5D SPI features patented third-generation sensor technology said to enable unique, simultaneous 2D and 3D inspection.

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BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.

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Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.

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Universal bit holder is now available with SwissGrip handle for exceptional comfort.

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SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.

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Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.

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