Sherlock automated design analysis software v. 5.3 now features thermal-mechanical analysis, which provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

PF606-P140 lead-free solder paste offers continuous high-speed printability and a wide reflow process window.

BotFactory SV2 is a desktop machine designed to print and assemble printed circuit boards on rigid or flexible materials directly from digital PCB layout tools.

Lord SC-800 UV cure silicone is a one-component, noncorrosive sealant designed to provide a flexible form-in-place gasket cured in place with UV light.

ESD-Safe films, tapes and labels protect ESD-sensitive (ESDS) devices.

Direct Connect Horizontal (DCH) high-speed press-fit twinax cable assembly targets high-performance flyover or coplanar right angle and parallel board-to-board applications.

ISO-Spector S2 5D SPI features patented third-generation sensor technology said to enable unique, simultaneous 2D and 3D inspection.

BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.

Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.

Universal bit holder is now available with SwissGrip handle for exceptional comfort.

SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.

Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.