FH58M FPC connector is 0.25mm pitch.

KY-P3 3D pin inspection now has back-end process AOI capabilities.

Indium8.9HF solder paste is halogen-free, no-clean and has an oxidation barrier said to eliminate head-in-pillow and graping.

Sarcon 20YR‐c is a versatile 0.2mm film that exhibits a thermal conductivity of 4.0W/m•K and a thermal resistance of 0.12°C•in²/W.

Ecolloy lead-free solder paste is a drop-in replacement for SAC 305.

NC 611 solder wire is for lead-free PCB assembly and rework.

No. 895 is a 1000°F (538°C) top-loading oven used for curing composite materials in large molds.

Atom 3 pick-and-place machine combines a pair of Pulsar heads on independent axes with 8-nozzle turret head on a third axis for devices up to 99mm x 99mm.

YSi-SP 3D solder paste inspection machine is based on “1-head solution” concept.

SP1550 printer handles boards up to 61" (1550mm).

Atom 4 pick-and-place machine has Pulsar pipette head that features eight nozzles, handling components from 01005 up to 13mm².

KY8030-3 SPI now includes integrated automated solder paste dispensing.