SMF-WC52 ultra tacky flux is applied in flip-chip dipping process.

Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.

New generation PF606-P140 Pb-free solder paste and PF606-P245 zero-halogen Pb-free solder paste have wide process windows, superior print and solderability to solve head on pillow issues and improve ICT testability.

New generation SMF-WB51 ultra-low residue liquid flux reportedly has superior spray uniformity, excellent soldering performance, and a wide process window for chip scale and fan-out wafer level -packaging.

Shenmao America
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Mycronic feeder repair kit for Agilis Flex feeders includes precision-machined aluminum side cover plate and matching barcode.

CircuitShield is an anti-corrosion, waterproofing, and reliability-enhancement nanocoating technology that protects semiconductor devices, printed circuit boards and other electronic components.

Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).

SAM-CT34NJW twin table PCB router has an online camera for programming.

FH64MA series compact flexible printed circuit (FPC) connector offers a profile of 0.5mm with 0.25mm pitch and depth of 3.15mm when locked.

EP41S-F two-part epoxy for bonding, sealing, coating and encapsulation applications combines ambient temperature cure speed with chemical resistance and superior electrical insulation properties.

Searay high-speed, high-density connectors come in 1.27 X 1.27mm open pin field grid array, with no pins dedicated as signal or ground.

DA 90 series are low-temperature die attach adhesives.