BR790-HD rework system aids in the removal, alignment, placement and soldering of BGAs, CSPs, ultra-fine-pitch QFPs, and other heat-sensitive SMDs. Has 1.3m pixel, split-vision optics and 15" high-res display. Component presentation nest is mounted to the optics’ X and Y drives; automates pickup and positioning of the component in the camera’s field of view and reduces handling of SMDs. Five separate input connectors allow positioning of K-type thermocouples. LCD touchscreen displays real-time temperatures and allows adjustment of top and bottom hot air heater settings. Includes edge-clamping system that adjusts to fit boards up to 21.6" x 19.7". Has 6-zone rapid IR under-heater. Capable of supplying up to 3600w of heating power.

Manncorp, www.manncorp.com

NanoClear stencil treatment is reportedly now 50% stronger. Reduces frequency of underside cleaning. Better performance from stencils with low aperture area ratios. Uses self-assembled monolayers with phosphonates that are compatible with common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.

Aculon, www.aculon.com

Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.

Indium, www.indium.com

Aquanox A8820 aqueous stencil cleaner is designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. Removes common solder pastes and fluxes; is compatible with stencil cleaning equipment. No-foaming property is compatible with materials used in electronic assembly manufacturing and cleaning processes. Comes in one, five, and 55 gal. containers.

Kyzen, www.kyzen.com

Konform Ultra fast-dry acrylic conformal coating provides insulation protection against high-voltage arcing and corona shorts. Provides a barrier against humidity, salt, corrosive vapors and fungus for printed circuit board and electronic assemblies. Dries quickly. Meets IPC-CC-830B Class B and sections of MIL-I-46058C, type AR. Contains UV indicator. Is compliant with RoHS and REACH.

Chemtronics, www.chemtronics.com

iPAG integrated paste and glue dispenser is for a stencil printer. Includes temperature control and a laser-based distance control. Can apply additional glue or paste depots directly after printing. Size, height and position of points are programmable. Compact heating element with temperature sensing is mounted onto the dispense head. Temperature of material can now be kept constant. Single or Twin iPAG is available. A retrofit is available for XACT 4, X5 Professional and X6 printer models. Reportedly suited for densely populated PCB layouts.

ASYS Group, www.asys-group.com

X65 pallet conveyor (from 500N to 1000N) reportedly permits higher loads. Has standardized pallet handling functions. Pallets are RFID ready. Contains fewer drive units and transfers, and has a lower noise level. Beam width is 65mm; max. speed is 120 m/min; max. conveyor length is 40m; pallet size is 100 x 128mm.

FlexLink, www.flexlink.com

Optymo 4.0 is designed to control parts management. Includes Version and Revision Control features to manage multiple revisions in design/supply/production. Now can classify BOMs on two levels; has configuration management covering optional parts, various quantities or different references; the ability to document BOMs and revisions, and tree view of BOMs. Can reduce transactions between clients and server, and optimizes background task management.

Inlynk Software, www.inlynksoft.com

In-Sight 7010C entry-level color vision system can distinguish parts by color. Features 24-bit color resolution that identifies 16 million color variations. Three additional color models include In-Sight 7200C, 7400C and 7402C. These systems solve more complex applications involving logic or color composition, as well as those requiring higher resolution or faster execution. Use EasyBuilder interface. Have IP67-rated housing; autofocus technology, and integrated lighting options.

Cognex, www.cognex.com/IS7000 

Eccobond UV9060F and EN3707F encapsulants reportedly provide barriers to environmental influences. Protect against contaminants like moisture and fluids, such as beverages and perspiration. Designed for high-UPH production environments, they cure with UV light in fewer than 30 sec.; contain cure mechanism to ensure shadowed areas not exposed to UV light are fully cured. UV9060F has a secondary moisture cure. A secondary thermal cure is built into EN 3707F. Both can be applied via non-contact dispensing or traditional needle dispensing. Include fluorescent tracer; exposure to black light illuminates fluorescent tracers.

Henkel, www.henkel.com/electronics

Technical Electronic Workstations are ergonomically designed. Have flexible standard components and accessory options above and below the work surface. Can be custom configured for height and length, as well as leg and pedestal supports, including Tech Leg, Tech Panel Leg, mobile bases, and cabinet pedestals. Many configurations feature a built-in electrical power supply on either an instrument riser or as part of the Nexus accessory system. Can choose from static-safe components, including ESD paint, work surfaces and shelves, conductive plastic boxes, and grounding accessories. Modular drawer storage cabinets can serve as pedestals.

Lista International, www.listaintl.com

X3L 3D inline x-ray inspection system comes with dual detector, combining a line-scan for transmission inspection of PCBs in a few sec. and a high-res digital flatpanel detector for selective 3D image capturing. Offers transmission, off-axis image capturing, and 3D-SART. Uses a readout TDI camera (line scanner) in parallel, reducing image capturing for 18x16" PCBs to fewer than 10 sec. 3D-SART (simultaneous algebraic reconstruction technique) provides slice images for solder joint analysis. Uses MIPS platform with links to MIPS software modules for programming, classifying and verification. MIPS verify now supports defect image verification with an extended 3D functionality.

MatriX Technologies, www.m-xt.com