Unitop modular dispensing robot can be used used either as a desktop or gantry system. Platform system can be mounted any work surface. Also can be used for conveyor fed requiring a gantry type mounting with open access under the robot, or installed in work cells operating as a slave robot. For gaskets, adhesives, potting, coating and filling. Robot comprises a control module, teach-pendant and articulated-gantry. Has a working area of 8” x 8” (200 x 200mm) with a resolution accuracy of 0.001mm.

Fisnar, http://www.fisnar.com/robots_f5200n

CBS shielding series has a rugged two-piece fence-and-cover design for easy access to board-level components during assembly and rework and provides a cover retention up to 2.5 lb./linear inch once attached. Comes in numerous fence height options to accommodate electronics components ranging from 0.13” to 0.80”. Can be specified for through-hole or surface-mount installation. Shielding effectiveness is reportedly 60 dB. Multiple finish plating options.

Leader Tech, leadertechinc.com

JX-200 high-speed compact mounter comes with a laser and high-resolution camera for vision placement. IPC-9850-rated speed of 13,900 cph for laser placement and 4,400cph for vision placement. Based on JX-100LED platform; handles boards of up to 1200mm.

Juki, www.jas-smt.com

E-MAX 903-E light-cure conformal coating cures with UV and visible light, using broad-spectrum and LED curing equipment. Features secondary moisture-cure mechanism for ambient cure in shadowed areas. Offers chemical resistance, low viscosity, and a tack-free cure immediately upon cooling after light exposure. Is available in 30ml syringes, 1-liter bottles and 5-gallon cans.

Ellsworth Adhesives, www.ellsworth.com

KE-3020V placement machine has a six-nozzle laser head plus a one-nozzle high-precision head with CDS sensor. Places 17,100 cph per IPC-9850; component range is 01005 to 74 x 74 mm or 50 x 150 mm; 25 mm high. Placement accuracy ±50 [U]m @3 Sigma using laser centering. Optional module processes flip-chips directly from wafers.

Juki Automation Systems, www.jas-smt.com

KE-3020V placement machine has a six-nozzle laser head plus a one-nozzle high-precision head with CDS sensor. Places 17,100 cph per IPC-9850; component range is 01005 to 74 x 74 mm or 50 x 150 mm; 25 mm high. Placement accuracy ±50 [U]m @3 Sigma using laser centering. Optional module processes flip-chips directly from wafers.

Juki Automation Systems, www.jas-smt.com

XJTAG Development System v. 2.6 boundary scan software comes with a new library that can auto-suggest the correct file based on the bill of materials and netlist information. Library is preinstalled with thousands of device files. Once BoM is entered, user can hit Suggest button, bringing up a selection of possible files, including common logic devices and a range of other parts. Now comes with new .NET interface and LabVIEW VIs. Can use formatted XJEase text output and access Layout Viewer.

XJTAG, www.xjtag.com

Z-Check Fixture series is for impedance verification on printed circuit boards with 50 ohm probing solutions; comes with several pitches for test coupons. Decreases error rate of impedance measurements. Can be connected to impedance-check TDR systems. Switching probe signals the start of the measurement and connected TDR software automatically takes and stores the measurements. Setup can be used for other impedances.

Ingun, www.ingun.de

JBC Touch soldering station has a high-resolution touch screen display and menu interface. Can be linked to an Ethernet network and connected to a microscope for viewing on soldering station’s 3.5" screen.

JBC Tools, www.jbctools.com

The DT series printed circuit board enclosure and header are designed to maintain the integrity and continuity of data and power signals in harsh environments; withstand dust, dirt, moisture and vibration. Thermoplastic enclosure accommodates a 5" x 6.5" PCB and features through-hole mounting flanges. Environmentally sealed snap in header features 90° molded in pins that mate with standard DT series plugs. Header is available in 12, 24, 36 or 48 cavity arrangements that accept size 16 contacts and 14-20 AWG wire.

LADD Industries, www.laddinc.com

3D inline x-ray system is available in X3 universal standard system and X3+, with triple detector setup. Both are based on the hardware concept of X2.5. 3D-Software uses a dedicated number of angle projections for 3D reconstruction; delivers 3D slice images needed for solder joint analysis. With algebraic reconstruction method, it is possible to generate high-resolution images for a reliable analysis with only a few projections. Analyze double-sided boards with high packing density. Generated slice images allow a separate 3D analysis for both sides of the board. Include inspection of high power components with heat sinks, where single contact layers can be separated for void or solder wetting analysis; a multilayer analysis of a solder joint is possible with digital 3D tomosynthesis. Use MIPS platform with links to all MIPS software modules for programming, classifying and verification.

MatriX Technologies, www.m-xt.com

Custom SMT pick-and-place nozzles for Cree XLamp XP-E high-efficiency white LED components reportedly reduce LED count by 50%. Designed to avoid placing mechanical stress on LED lens by not touching optical surface during component picking or placement processes. Can be applied to any style pick-and-place nozzle.

Count On Tools, www.cotinc.com