LabelScan handheld automated vision system can take a single image of all the fields on a supplier barcode label. Features an advanced algorithm to recognize different fields of data and transfer this data in a suitable format to any application used for receiving materials, such as an MES, MRP or ERP.

Cogiscan Inc., www.cogiscan.com  

FootprintGen app is said to accurately automate generation of complex PCB footprint (land pattern) models in less time than manual methods.

Supports user-defined and IPC-7351 standard settings across a range of component families. Uses a process driven by rules, settings and component dimensioning forms. Supports BGA, chip, array, DIP, LCC, LGA, PLCC, QFN, QFP, SOJ, and SOP families. Supports multiple user settings with user-configurable line and text widths for solder mask, assembly, pad, and other layers. D-shape, oblong or rectangular pad shapes available, as are custom pad shapes with rounding or chamfering specifications. Pad stacks are user-configurable and can be assigned to unique locations including corner pads or specific row/column positions. Integrates seamlessly with OrCAD and Allegro PCB. Footprint models can be verified and correlated to schematic symbol models to identify errors or discrepancies.

EMA Design Automation, www.ema-eda.com/orcadapps

TestWay Express provides an integrated workflow for DfT and test coverage analysis from design through to product delivery. Is said to analyze and verify testability at each stage of the design to delivery workflow within a single tool. Verifies mechanical rules, allocates test probes and estimates test coverage based on actual physical access. Generates test programs, input lists and test models, and test fixture files. Operates directly from native CAD formats. Reads completed test program or test report and compares coverage between estimated and measured analysis. Coverage importers available for a range of common test/inspection machines

Aster Technologies, Aster-Technologies.com

SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to atmospheric moisture. It cures to form an elastic, flame retardant silicone rubber and exhibits primerless adhesion to many substrates.

Momentive Performance Materials, momentiveperformancematerials.com

A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.

Practical Components, www.practicalcomponents.com

A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.

Practical Components, www.practicalcomponents.com

TT-400 tabletop soldering robot platform features 150W hot iron soldering robots, a 400 mm x 365 mm soldering area, tip cleaning station (sponge and air bow off), and camera. Other features include: USB port for program save or load modes to enable program transfer, simulation mode (for process validation prior to soldering), and 64 bit high speed on-board processor. Stores and recalls up to 100 programs, each having up to 9,999 instruction points.

Promation, www.pro-mation-inc.com

GreenData Manager environmental compliance software now exports IPC-1752A XML files at the component level. Can be used as a data conversion tool, generating product-level IPC-1752A XML reports from individual component data. Determines whether a component, subassembly or complete product is compliant with a wide variety of regulations. Substances list now more than 24,000, and recent changes to the REACH SVHC Candidate list included.

GreenSoft Technology, greensofttech.com

CN-1736 reworkable underfill encapsulant is designed to underfill 0.4mm pitch package-on-package assemblies. Has low viscosity and CTE. Reportedly has greater flux compatibility than predecessors. Has a viscosity of 650cps and a CTE of 55 ppm/°C. Rework is accomplished with temperature of 170°C to 180°C.

Zymet, www.zymet.com

Ablestik ICP-3535M1 one-component, pre-mixed electrically conductive adhesive provides low and stable contact resistance when used with 100% tin-terminated components. Offers lower temperature processing, lower stress assemblies and regulatory-compliant Pb-free formulations. Attaches to a variety of substrates, including low-temperature co-fired ceramics, high-temperature ceramics, and OSP-finished printed circuit boards. Reportedly maintains stable contact resistance and good mechanical integrity after 3,000 hrs. of temperature and humidity testing, 3,000 cycles of thermal shock evaluation, and 3,000 hrs. of heat storage. 

Henkel, www.henkel.com/electronics

Ablestik ICP-3535M1 one-component, pre-mixed electrically conductive adhesive provides low and stable contact resistance when used with 100% tin-terminated components. Offers lower temperature processing, lower stress assemblies and regulatory-compliant Pb-free formulations. Attaches to a variety of substrates, including low-temperature co-fired ceramics, high-temperature ceramics, and OSP-finished printed circuit boards. Reportedly maintains stable contact resistance and good mechanical integrity after 3,000 hrs. of temperature and humidity testing, 3,000 cycles of thermal shock evaluation, and 3,000 hrs. of heat storage. 

Henkel, www.henkel.com/electronics

DataMan 300 fixed-mount industrial ID reader increases barcode read rates with a 1DMax+ algorithm. Incorporates Hotbars technology, which uses texture to locate barcodes at any orientation, and then extracts high-resolution 1-D signals for decoding. For 2-D matrix and difficult-to-read direct part mark codes, reading has been improved with an upgraded algorithm. Offers enhancements in handling damaged codes at high line rates and poorly marked or extremely damaged codes. Model 300 provides standard resolution (800 x 600 pixels); model 302 (1280 x 1024 pixels) is for reading small DPM codes on small components.

Cognex, www.cognex.com/300