Pasternack’s new series of field-replaceable connectors feature frequency coverage to 65 GHz, plus SMA, 2.92 mm, 2.4 mm and 1.85 mm connector options with many pin types, including glass bead feed-through or a tab contact, or a pin in a dielectric.

Assist in easily replacing damaged connectors without accessing sealed components, and EMI gaskets provide shielding against RF interference. Contacts mate with five-pin diameters ranging from 0.009" to 0.036". Two-hole and four-hole flange types make for easy assembly in hard-to-reach areas where flexibility is required.

Pastermack

www.pasternack.com

PF735-EP307 joint enhanced solder paste (JEP) is a low-melting-point epoxy-based solder material for extremely fine-pitch or fine-pad soldering, especially advanced display assembly.

MSA Series smoke absorbers are space-saving compact workbench fans that use activated carbon filters to extract harmful flux fumes and smoke during hand soldering operations.

3Di-LS3 3-D automated optical inspection system has dome lighting option that enhances color profile of non-flat areas.

Ersa i-CON TRACE allows soldering processes in electronics manufacturing to be improved and seamlessly documented. Ensures traceability for manual soldering processes for the first time. Records process information seamlessly and offers visual reports.

Equipped with WiFi, Bluetooth and optionally with a network card, and has a heating power of 150W. Has a characteristic operating concept and can be controlled using mobile end devices such as a notebook, tablet, or smartphone. Can be used both as a stand-alone soldering station with pre-set parameters and integrated into MES (Manufacturing Execution System)-controlled production processes.

Soldering tip range increases the efficiency of energy transfer by up to 30%, and the Tip'n'Turn quick-change system allows the uncomplicated, quick, and safe change of the soldering tips offered in different shapes and sizes.

Ersa

www.kurtzersa.com/

Vishay Vitramon DC Blocking Capacitors are surface-mount multilayer ceramic chip capacitors (MLCC) optimized for DC blocking applications. Industry’s first such devices characterized for common frequency bands ranging from 3MHz to 18GHz.

Fluxless Thermo-Compression Bonder eliminates contamination concerns while ensuring interconnect integrity through unique and integrated fluxless delivery module. Capable of supporting the majority of emerging heterogeneous packaging needs down to 10µm.

Kulicke & Soffa

www.kns.com

VerifyBoost delivers faster verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices, enabling the leverage of existing production capacity for significant throughput gains and reducing the total cost of programming. Can deliver up to 4.5x improvement in programming performance and reduce the total cost of programming by up to 39%.

Data I/O

https://www.dataio.com/

ITW EAE is releasing a syringe cooling option that increases the “pot-life” of underfill materials by maintaining the syringe at controlled temperature within the heated machine environment. Provides reduced material waste, reduces downtime and increased process stability, and is available as an option for the Prodigy dispensing system and works with all Camalot pumps.

3Xi-M200 V2 3D-CT AXI reduces cycle time while improving inspection image quality and lowering maintenance requirements.

MLFM15 measures 2.2mm by 1.1mm nominal and now comes in 0.3W power rating for tolerances 0.5% and above and TCR’s of 50ppm and higher.

Supercooled BiSn solder paste encapsulates liquid metal in soft shell to keep solder alloy below its normal freezing point.