Fujipoly America's CF210A thermal gap filler incorporates carbon fibers along with traditional fillers. Carbon fibers allow for higher thermal conductivity while remaining compliant. Compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A. Has a stable thermal resistance, regardless of compression.

PVA's new Valve Kiosk Stand for trade shows features 18 valves that cover an array of applications including dispensing, gasketing, conformal coating, thermal interface material, underfill, jetting and potting.

Also features three 15.6” touch screen interfaces with an interactive user interface. Includes removable valves for closer inspection and in-depth breakdowns of each valve: Overview, X-ray, Operation, Applications & Dispense Patterns. Customers can navigate by Industry, Application, Valve type or “Request Help." Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.

PVA

www.pva.net

Mycronic's Iris 3D AOI features a new generation of laser scanners, image sensors and computing systems to improve test coverage while capturing nearly twice as many pixels at speeds up to 30% faster than previous technologies.

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.

Requires a cure at only 80°C for 1.5 to 2 hours. Features a thixotropic paste consistency and adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.

Electrically insulating, with a volume resistivity greater than 1014 ohm-cm. Features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. High strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000-27,000 psi.

Exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. Serviceable over the temperature range of -50°C to +150°C and has a glass transition temperature of 110-115°C. Available in 3cc, 5cc, 10cc and 30cc syringes and ships in dry ice.

Master Bond

www.masterbond.com

The new silver ink series exhibits excellent electrical conductivity and good adhesion to a vast array of substrates, particularly those within the LCD market. 

Specifically designed to reduce surface and FPC static electricity in smartphone screens, notebook screens, and TV screens. Features wide-ranging capabilities, extended run time with continuous dispensing, no breakage in threads or needles, low temperature properties, excellent storage stability, excellent weather resistance and extremely fast cure time. 

Scope of viscosity ranges from 3000 CPS to 20000 CPs with the low viscosity SCPT and SCPW-6 meeting the needs of spray valve dispensing and thin layer applications, whilst SCPH, SCPW and SCP-HV are more suited for needle valve dispensing and low volume shrinkage. Also shows excellent levelling performance with seamless ohmic contact and adhesion with the substrate. After complete cure, demonstrates solid electrical conductivity with volume resistivity at <10 -3 Ω.cm, ensuring swift and effective export of excess electrostatic charge through the system to avoid damage to the display panel. Available in a range of sizes including 5ml, 10ml and 30ml.

Electrolube

www.electrolube.com

ITW EAE's Auto Exit Wing for Electrovert Wave Soldering machines provides automatic adjustment of the laminar wave flow to match the board velocity.

Is said to provide highly repeatable, precisely controlled exit wing adjustment that can deliver up to a 70% reduction in bridging defects and improved topside hole fill. Activated by a recipe-controlled set-point to ensure optimal wave dynamics for every PCB type and application. Fully compatible with all Electrovert UltraFill 4.0 and DwellMax 4.0 nozzles in both Air and N2 Tunnel environments and is field upgradeable.

ITW EAE

www.itweae.com

Transition Automation's double-edge squeegee assembly for Yamaha YSP SMT printer platforms now has end-anchor points to improve the life of the assembly by preventing the boundary limited bonding that can cause separation. Designed to help end users eliminate machine downtime and repeat process interruption.

Transition Automation

www.metalsqueegees.com

WXsmart soldering platform consists of 2-channel soldering station and includes WXair hot-air module for in-air and vacuum requirements. WXMPS MS smart soldering iron has ergonomic pencil design that fits in operator’s hands, providing precision for small soldering applications under the microscope. Performs pico, micro and ultra soldering.

Nihon Superior's LF-C2 Lead-Free Solder Paste delivers long life in thermal cycling but with a compliance that means that it is resistant to cracking under stress typical with automotive electronics.

Uses calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix. With a liquidus temperature of 213°C, can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305. Delivers excellent performance over a wide range of component types and process parameters.

Nihon Superior

www.nihonsuperior.co.jp

Rohm Semiconductor's CSL1901 series of 0603-size (0.6in × 0.3in)/1608-size (1.6mm × 0.8mm) LEDs are optimized for low-light applications for use in indicators and numeric displays in factory automation equipment (i.e., PLCs) and communication control equipment such as modems and routers.

Reduces brightness variations by half and color sifting by 3nm under low-light conditions. Available in a lineup of five colors in 0603 size.

Rohm Semiconductor

www.rohm.com

Loctite Ablestik ICP 2120 electrically conductive adhesive cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).

Indium Corporation's PicoShot WS-5M is a water-soluble, halogen-free paste for its Mycronic MY-series jet printers.

Delivers smallest dot volume (6.5nl/dot, 350µm diameter) among pastes in its class, precision deposit (x,y targeting), long usage (syringe life >8 hours), minimal statellites.

Can be used in applications such as jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil replacement, CSP/microBGA solder attach, military and aerospace jetting applications, system-in-package (SiP), camera module assembly where an overmolding step is required, and shield-attach and secondary processing.

Indium Corporation

www.indium.com