MINNEAPOLIS -- Alan Rae of NanoDynamics took home the best paper award at January's Pan Pacific Microelectronics Symposium.

Rae's paper, "Nanotechnology and Low Temperature Electronics Assembly," discussed concerns among board assemblers that some components are not - and will not - be ready for lead-free assembly. 

He also revealed that assemblers of "exempt" boards -- military, aerospace, and automotive -- are finding that lead-containing components may no longer be available, which will force conversion of these complex boards.

Nanotechnology, Rae says, enables a number of tools which permit lower temperature assembly through enhanced solders, adhesives and novel attachment methods.

The award was selected by attendees of the Pan Pacific Symposium, which is sponsored by the SMTA.

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