Minneapolis -- Sponsored by the SMTA, the Pan Pacific Microelectronics symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology,and assembly. The symposium is scheduled for January 17-19, 2006 at the Marriott Waikola Hotel, Hawaii.

The program committee seeking participants to present recent research results on the following topics:
Business:
Cross Cultural Management, Economics and Cost Analysis, Green Manufacturing (Energy Conservation, Pb- and Halogen-free, etc.), Manufacturing Management, Outsourcing Strategies, Roadmaps.
 
Packaging:
3-D and Stacked Packages, BGA, Chip Scale, Display Drivers, Embedded Devices, Flip Chip, Integrated Passive Devices (IPDs), MCM/SiP, RF and Microwave, Thermal Management, Wafer Level Assembly.

Interconnection:
Advanced PWBs, Co-Fired Ceramics, Flat Panel Displays, Flex / Flex Rigid, HDI, Microvias, Shaped Circuits, Thin and Thick Film Materials.

Markets:
Characterizations, Penetration Strategies, Segmentation, Technology Drivers, Trends and Forecasts.

Assembly:
Automation Control, Component Placement, Direct Chip Attach, Materials and Processes, Repair and Rework, Test and Troubleshooting.

Microsystems and Nanotechnology:
Actuators, DFX, MEMS/MOEMS, Nanomaterials, Nanosystems, Optoelectronics, Partitioning Strategies, Sensors.
 
Abstracts should be submitted online by July 15, 2005: smta.org/pan_pac.  
 
 
 
 
 

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