West Conshohocken, PA -- At the end of March, Heraeus Circuit Materials Division acquired the ultra-fine-pitch solder powder technology and business from Welco GmbH (Potsdam, Germany). 

According to the companies, the continued miniaturization of electronics assemblies has resulted in a greater demand for solder pastes with very fine solder powder particles that can no longer be manufactured economically using conventional methods. Heraeus decided to acquire expertise by taking over the patented technology and production facilities for the manufacture of ultra-fine-pitch solder powders from Welco.

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