San Diego — KIC, Henkel Technologies, Engent, Speedline Technologies, Cogiscan and OK International will co-sponsor a lead-free workshop on May 18-19, at the Henkel Technologies facility in Irvine, CA.

The hands-on training program is designed for engineers and engineering management, and will provide a broad knowledge of lead-free materials interactions, and an understanding of the process (including advantages and limitations). A sample lead-free board will be produced and taken away by each attendee.
 
· Dr. Neil Poole and Dr. Brian Toleno of Henkel Technologies will present on material interactions, surface mount adhesives, underfills, conformal coatings and alloy reliability.
· Dr. Daniel Baldwin of Engent will discuss process engineering methods, analytical tools and design of experiment (DOE).
· Francois Monette of Cogiscan Inc. will present on material logistics and identification, component compatibility and the impact of MSD.
· Marybeth Allen of KIC will discuss management of the thermal processes as they relate to the conversion to lead-free manufacturing.
· Grant Miller of OK International will present on rework with lead-free devices.
· Keith Howell of Speedline Technologies will present on wave and reflow processes.
 
The workshop will feature hands-on production floor training in the following areas:

· Screen printing surface mount adhesives and solder paste, and placement
· Reflow profiling
· Inspection/analytical
· Rework
· Wave.

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