HERNDON, VA - The International Electronics Manufacturing Initiative (iNEMI) is sponsoring a workshop on tin whiskers as part of IEEE's Electronic Components and Technology Conference on May 31-June 3, in Lake Buena Vista, FL. iNEMI will present the results of its third set of whisker experiments, , which provide additional insight into tin whisker formation and growth. 
 
Presentations will also cover the latest theories regarding the cause and effect of stress formation in tin film, the mechanism by which material moves through the structure, and the causes of whisker growth. In addition, a recently discovered factor in tin whisker generation will be discussed - heavy oxidation or "corrosion" of the tin in humid environments. Data on testing and the impact of oxidation on whisker growth will be covered.
 
Dr. Henning Leidecker, NASA, will serve as moderator for the workshop.  The event is chaired by Ron Gedney, iNEMI consultant, and Maureen Williams, NIST.  For a complete agenda:
http://www.inemi.org/cms/calendar/tin_whisker_workshop.html.
 
 
In addition to the iNEMI workshop, the ECTC technical program includes a session on solder and tin whiskers (Session #10, Materials & Processing Committee) on June 1.
Online registration is available at
https://www.ec-central.org/conference/ectc/55/doorregistrationform.cfm.

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