Avo Photonics Develops Pb-Free TEC-to-Package Process
HORSHAM, PA - Avo Photonics, specialists in RF and optical packaging solutions, has developed a lead-free TEC-to-Package process. The process works for high-quality, high-performance applications, while meeting regulations requiring lead-free electronics components. The process has been qualified and can be used for volume production of assemblies.
The process caters to markets requiring high-end thermoelectric cooler (TEC) packages, used in a variety of telecommunications, medical and military applications (such as lasers, temperature-controlled etalons, high-speed detectors and temperature reference sources).The TEC-to-Package process includes solder bonding the TEC within a non-oxidizing inert gas environment leading to void-free coverage. Said to result in excellent thermal conductivity across the interface and very rugged bond strengths. Includes surface acoustic microscopy (SAM) testing to verify void-free results. For TECs without wirebond posts, Avo trims, forms and simultaneously reflows the solder to bond the TEC leads to the package within the TEC packaging process.
The TEC-to-Package process includes solder bonding the TEC within a non-oxidizing inert gas environment leading to void-free coverage. Said to result in excellent thermal conductivity across the interface and very rugged bond strengths. Includes surface acoustic microscopy (SAM) testing to verify void-free results. For TECs without wirebond posts, Avo trims, forms and simultaneously reflows the solder to bond the TEC leads to the package within the TEC packaging process.The company provides complimentary initial technical consultation and proposals for its TEC-to Package services in as little as 24 hours.
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