MINNEAPOLIS, MN - The co-located SMTA International and ATExpo show on Sept 25-29, in Rosemont, IL, will once again feature the Emerging Technologies Summit. The summit is a series of three paper sessions and a panel discussion (moderated bySteve Greathouse of Intel Corp.) addressing the latest trend in electronics manufacturing and assembly.

The first session, Roadmaps, will feature papers on iNEMI's Optoelectronics Roadmap for 2004, Emerging Nanotechnology and Its Effect on Electronics Manufacturing, and Free Silicon Marketing Strategy.

The next session, Turning Lead Into Gold, will feature papers on Gold Bump Technologies, Flip Chip Ultrasonic Gold-to-Gold Interconnect for High Bump Count Devices, Adhesive Flip Chip for Large Arrayed Devices, and Packaging of High-Power LEDs Using Au Studbump Interconnects.

The last session, Advanced Power Technology, will feature papers on mPowerChip: A Solution for Integrated Power for Microsystems and Integration of Active and Passive Components Using Chip in Polymer Technology.

For further details and for event registration, visit smta.org/smtai/

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