FREMONT, CA -- SensArray Corp.’s new Assembly and Test Business Unit delivers process optimization tools for backend semiconductor manufacturers. The unit currently markets six applications, as well as custom control systems for the wafer bumping process.

Backend assembly and test, including wafer solder bumping and solder reflow, requires increasing thermal monitoring and control. As temperature controls narrow from +/- 10 to +/- 5°C, and soon to +/- 1°C, tighter tolerances are necessary; meanwhile temperatures are going up, demanding even more process control.

The company has created a system bundle from its current tools for measuring real-time, in situ temperature in backend processes. These include:

* Process Probe 1935 thermocouple (TC)-instrumented wafer used to check wafer center-to-edge thermal stresses during loading and ramping,and calibrate temperature set-points in ovens with confidence;

* Process Probe 1630 TC-instrumented wafer designed for reflow oven profiling up to 800°C;

* Process Probe Custom Reflow Probes to determine edge-to-center temperature to adjust heater zone set points, and measure and adjust drift in temperature due to oxide build-up on the heaters and belt;

* PDA-based Thermal TRACK measurement systems, used with Process Probes, for real-time visual representations of the wafer temperature and uniformity measurements;

* Laptop-based Thermal MAP metrology systems to deliver graphic representations of temperature ramp-up, steady state and ramp-down;

* Intelligent Sensor Interface System (ISIS) 5 module is wireless, using Bluetooth technology for portability and ease-of-use.

Currently available in the U.S., Europe and Asia. For more info, visit sensarray.com.

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