Circuits Assembly Online Magazine - Chip Giants Launch $600m Next-Gen Chip Project

ALBANY, NY - IBM, Advanced Micro Devices, Infineon Technologies and Micron Technology will team with the state of New York on a five-year, $600 million project to create next-generation semiconductors.

The manufacturers will contribute $200 million in funding and equipment to the project, which will be officially launched today. New York will pony up $180 million. The remaining funds will come from suppliers of materials and equipment.

Work will take place at the University at Albany. More than 500 researchers, engineers and other workers are expected to work on the project, which will focus on lithography. The partners are calling the project INVENT.

Notably absent from the group is Intel, the world's largest chipmaker. An INVENT spokesman said he believes the company will eventually join the consortium.