BINGHAMTON, NY – Endicott Interconnect Technologies has selected the AdVantis and Polaris platforms from Universal Instruments Corp. for military product applications, Universal said today.

The companies said the platforms were selected in order to automate production of a chip carrier for a leading military supplier. The product features several hundred surface-mount components, several memory devices and a very large heat spreader, the companies said. 

AdVantis is a flip chip placement system; Polaris handles multiple assembly processes, including dispensing and underfill. 

EI is a spinoff from IBM and builds chip packages, printed circuit boards and electronics assemblies.