Washington, DC – Plans are underway for the IMAPS International Conference and Exhibition on Device Packaging, March 20 – 23, 2006, in Scottsdale, AZ.

The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”

It will also feature an exhibition and technology showcase.

For more info., visit imaps.org/devicepackaging.

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