FRANKLIN, MA – As SMT manufacturing continues to move towards smaller components, it becomes increasingly important to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, process engineers must understand every aspect of the fine printing process.
 
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST. 
 
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
 

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