Hudson, NH – CeTaQ America has enhanced capability for testing live QFPs during Machine Capability Analysis (MCA) testing.
 
“Rather than using dummy components, the ability to use the live QFPs brings MCA testing right up to the electronics manufacturer’s real-world manufacturing scenario,” Michael Sivigny, general manager, said in a statement. “This makes our testing methodology the most relevant and accurate that it can possibly be.”
 
MCA testing is a third party evaluation methodology that uses special vision algorithms, glass plates and components to measure Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. The goal is to verify that a machine is performing to the manufacturer’s original specifications, and make any necessary corrective adjustments if it is not.
 
In testing placement accuracy, for example, the actual fine pitch QFP components and various types of leaded devices can now be used. The pick-and-place machine places components on the test fixture marked with local reference points and fiducials. The components are analyzed against data from component data sheets. Measurements and statistical data are collected for calculating Cp and Cpk indices on side overhang, toe overhang and lead pitch, for example. These results can be used to feedback quality of incoming component material to component suppliers. The QFP components are not harmed during testing and can be returned to parts inventories for assembly after passing capability inspection.

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