The Surface Mount Technology Association (SMTA, Minneapolis, MN) is co-locating its annual conference, SMTA International, with the Assembly Tech Expo on September 26-30, in Rosemont, IL.

Many events are planned for industry professionals who have an interest specifically in lead-free soldering technology. To help industry professionals prepare for the 2006 deadline, this year's event will feature eight short courses, close to 40 technical papers and a Lead-Free Soldering Symposium.

The short courses will cover: Lead-Free Solder Joint Reliability; Lead-Free Conversion Project; Real Time Process Control, Including Lead-Free; Lead-Free Rework; Lead-Free Surface Finishes; Implementing Lead-Free at Your Facility; The Real Cost of Lead-Free; and Ten Steps to an Effective RoHs Compliance Process.

The technical papers will cover printing, selective soldering, moisture-sensitive devices (MSD), rework, ball grid array (BGA), flip chip, harsh environments, surface finishes, automated optical inspection (AOI), x-ray, tin whiskers, lead-free materials, processes and reliability.

Organized by Dr. Paul T. Vianco of Sandia National Labs, the symposium will provide technical information on alternative materials systems, tin whiskers, lead-free processing techniques and the growing knowledge base of lead-free solder joint reliability, as they related to lead-free technology.

Additionally, a free session entitled "Lead-Free: Where Are We Right Now?" will explore the transition from standard leaded solders in a volume-manufacturing environment with papers from Agilent, Flextronics and Indium Corp. of America. The SMTAI Opening Ceremony will focus on RoHS Compliance.

www.smta.org/smtai/index.cfm

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