National Semiconductor (Santa Clara, CA) has announced that it will offer lead-free packages for its complete line of integrated circuit (IC) products by the end of 2004. The company also will significantly reduce bromine and antimony-based flame-retardants in an effort to make more environmentally neutral electronic components.

Today, approximately 90% of National's portfolio of 15,000 analog and mixed-signal ICs is available in lead-free package types. Lead was formerly used in the plating finish of copper leadframe-based packages. It was also used in the solder balls of array packages such as micro surface mount device (SMD), PBGA and FBGA packages. National will replace the lead in leadframe packages with a matte tin finish and in the solder balls with a tin-silver-copper alloy. Once this aggressive program is fully implemented, National expects to replace approximately five tons of lead used per year.

"Samsung is currently using about one-half dozen different lead-free ICs from National Semiconductor in its flat panel display (FPD) products which are sold worldwide," said Soo Kyung Yoo, vice president Quality Team, Display Device Center, Samsung Electronics Co. Ltd. "In addition, we have aggressive plans in place to adopt National's lead-free ICs for use in a wide variety of other Samsung products."

Packaging is a critical part of the semiconductor manufacturing process. National's advanced package technologies enable its customers to build cell phones, displays, computers and many other electronic products that are small, thin, lightweight and have long-lasting battery life.

www.national.com/packaging/leadfree/

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