SMTA Requests Papers for Wafer-Level Packaging Conference
Published: 16 January 2007
by Staff
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
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