SAN JOSE – Stanford professor of engineering Roger Howe will keynote the 5th Annual MEMS Packaging symposium, the MicroElectronics Packaging and Test Engineering Council announced. On May 16, Howe will discuss recent developments in the field. Howe, who has decades of experience with MEMS, also chaired the MEMS Technical Committee of IEEE Electron Devices Society from 1998 – 2001. The conference takes place May 16-17 in San Jose. Other presentations include MEMS-based market evolution; emerging trends; packaging technologies, and consumer and industrial applications. Graduate students, professors and university researchers will also present their latest work on MEMS packaging and related topics. To register or learn more about the symposium, contact Bette Cooper, bcooper@meptec.org or visit www.meptec.org.