Circuits Assembly Online Magazine - Khaykin to Present WLP Conference Keynote

EDINA, MN – Amkor Technology COO and executive vice president Oleg Khaykin will keynote this year’s International Wafer-Level Packaging Conference.

The talk will take place on Sept. 18 in San Jose.

The 4th Annual IWLPC runs Sept. 17-19, with full-day workshops, a technical conference and a tabletop exhibition.

For a complete program schedule and registration visit www.smta.org/iwlpc.