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MANASSAS, VAZestron America recently completed a series of experimental tests confirming Vigon SC 200 to be fully compatible with organic solderability preservative misprinted board cleaning, the company reports.

The testing was conducted at Zestron’s technical center using a variety of lead and lead-free materials from solder paste manufacturers. 
 
The experiments were conducted in ultrasonic and spray-in-air equipment. Variation in spray pressure ranging from 30 to 50 psi and ultrasonic frequency ranging from 10 to 20 watts per liter were considered, says Zestron.
 
The MPC technology-based cleaning agent was deliberately tested at 122°F to examine the worst-case scenario. Each misprinted board wash process was followed by two minutes of DI-water rinse and drying with hot circulated air for 15 minutes.

Excellent compatibility testing with OSP misprinted board cleaning was achieved at a maximum exposure time ranging from two to four minutes, depending on the solder paste formulation, the company says.
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