MANASSAS, VA – Zestron America recently completed a series of experimental tests confirming Vigon SC 200 to be fully compatible with organic solderability preservative misprinted board cleaning, the company reports.

The experiments were conducted in ultrasonic and spray-in-air equipment. Variation in spray pressure ranging from 30 to 50 psi and ultrasonic frequency ranging from 10 to 20 watts per liter were considered, says Zestron.

The MPC technology-based cleaning agent was deliberately tested at 122°F to examine the worst-case scenario. Each misprinted board wash process was followed by two minutes of DI-water rinse and drying with hot circulated air for 15 minutes.

Excellent compatibility testing with OSP misprinted board cleaning was achieved at a maximum exposure time ranging from two to four minutes, depending on the solder paste formulation, the company says.