SHENZHEN – SMTA China announced it will sponsor the upcoming SMTA China South Conference 2007. Reed Exhibitions will support the conference in conjunction with the Nepcon China 2007 exhibition at the Shenzhen Convention & Exhibition Center.

It is scheduled to take place Aug. 27-30 in Shenzhen, China.

This event will feature technical papers, workshops and training sessions, as well as the Emerging Technologies Summit and three symposia across seven tracks: manufacturing and assembly, advanced packaging, substrates, soldering, test/inspection/quality, process Control, and contract manufacturing/business issues.

Conference topics include 01005 assembly, 3-D system in package (SiP), package on package (PoP), Pb-free reliability, component supply integrity, legal responsibility of non-RoHS part/product entering Europe, materials and process characterization, and flex circuit assembly.

For more information and to register, contact Peggy Chen at +86-21-5609-3010 or peggy@smta.org.