Endicott Interconnect Wins Additional $19M in DoD Work
Published: 22 August 2007
by Staff
ENDICOTT, NY — The U.S. Department of Defense has increased an existing contract with Endicott Interconnect Technologies by $19 million to cover additional multichip module assemblies and equipment, the company reports.
EI recently bought a flip-chip packaging line, including a screen printer, placement machines, reflow oven and AOI tools to build the additional MCMs.
Press Releases
- Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
- SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
- Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
- Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities