Endicott Interconnect Wins Additional $19M in DoD Work
Published: 22 August 2007
by Staff
ENDICOTT, NY — The U.S. Department of Defense has increased an existing contract with Endicott Interconnect Technologies by $19 million to cover additional multichip module assemblies and equipment, the company reports.
EI recently bought a flip-chip packaging line, including a screen printer, placement machines, reflow oven and AOI tools to build the additional MCMs.
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