ANAHEIM, CA – Dan Baldwin, PhD, founder and president of Engent Inc. and Adjunct Professor of Georgia Tech Institute will speak on Sept. 29 about an Experimental Wetting Dynamics Study Of Eutectic and Lead-Free Solders.

This SMTA LA/OC Chapter meeting will take place at the Embassy Suites Hotel, Anaheim, at 6 p.m.

The effects of solder reflow process parameters and bonding materials will be discussed, as they relate to the physics of solder wetting and the interconnect process yield and solder joint reliability.

The experimental setup consists of a high-speed image acquisition system and a temperature chamber that were used to measure the time-dependent behavior of molten solder spheres onto bond pads under an isothermal condition. The solder materials investigated are eutectic tin-lead solder and lead-free 95.5Sn-4.0Ag-0.5Cu solder. The wetting dynamics of the solder materials were investigated on Cu, Cu/OSP, and Cu/Ni/Au bond pads, with several different flux systems, at different environmental temperatures, with various solder sphere sizes.

The experimental observations indicate that the wetting dynamics clearly depend on temperature, solder materials and substrate metallization, but do not depend significantly on the flux system or the solder sphere size.

Visit www.laocsmta.org for more information.