FRANKLIN, MA – Speedline Technologies will present two free Webinars on Feb. 16, covering issues involved the 0201 and 01005 component assembly process.
 
Two live sessions are available:  the first at 2-3 a.m. EST (2-3 p.m. Singapore Time), and the second from 11 a.m. to 12 noon EST.
 
The Webinars will consist of a presentation, discussion of new technologies and techniques, practical advice and a Q&A opportunity. 
 
Specific areas of discussion will include:
    * PCB Pad Design
    * Solder Paste Printing
    * Solder Paste Selection
    * Component Placement
    * Reflow Soldering
    * Inspection
 

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