Endicott, NY – Endicott Interconnect Technologies has entered into a joint development and manufacturing agreement for high performance power modules with a major research lab. The agreement calls for technology transfer of development know how, including the fabrication process and manufacturing parameters from the research firm to EI. EI is supplying prototypes for the power module qualification.

The technology was developed to address the performance limitations that current packaging and interconnection approaches impose upon high performance power semiconductor devices. The product relies on flexible substrates and a direct die attach to connect to power electronic devices. This method eliminates wire bonds, while attaining a small footprint, thin profile and high reliability.