Circuits Assembly Online Magazine - Agilent and Speedline Research Closed-Loop Printing

PALO ALTO, CA -- Agilent Technologies and the Advanced Development Group of Speedline Technologies are conducting joint research on the implementation of closed-loop process control for paste printing PCB assemblies. The research will use Agilent's post-print inspection systems and Speedline's Accela printer to measure process performance in Pb-free manufacturing.

Based on a recent joint Pb-free study, Agilent and Speedline determined that the positional accuracy of the paste deposit relative to the pad is a key element to ensure quality in fine-pitch and small-device Pb-free assemblies. This suggests that closed-loop process control could be advantageous for quality during the transition to Pb-free manufacturing.

In follow-up testing still under way, the companies have demonstrated the potential to establish a closed-loop control method between the AOI system and the printer to manage positional accuracy of the pasted deposits.

Further details will be discussed during a session at the upcoming Apex show entitled, "Closed-Loop Process Control in the Solder Paste Printing Process." A preview of this technology and discussion of the research project will be available at Speedline’s booth, #1207.