ENDICOTT, NY -- Endicott Interconnect Technologies and Meadville Technologies Group Ltd. have entered a licensing agreement to produce EI's patented organic substrates at the Meadville's facility in Shanghai.

Under terms of the agreement, EI maintains control of the design, prototype, new product introduction, low to medium volume production, particularly for aerospace and defense applications, sales and technical support worldwide for the CoreEZ product line. Meadville will perform high volume runs of CoreEZ products.

No financial terms were disclosed.
EI, the former manufacturing site for IBM, retains all IP related to the product.

In a statement, EI president and chief executive Jay McNamara said, “Leveraging EI’s technology and production capabilities allows us to broaden our customer base and penetrate markets we do not currently serve. Working with Meadville Technologies Group allows us to offer high volume production and premier low-cost manufacturing.

He said the move should lead to higher volumes of customers for EI.

Tom Tang, chairman and group managing director of Meadville, said, “As semiconductor investment continues to grow substantially in China, I am confident that EI’s design capabilities together with Meadville Technologies Group's manufacturing expertise will provide an advanced and cost competitive solution to the fast-growing semiconductor market in this region as well as worldwide.”

Meadville sprung in the mid 1980s from OPC, a Hong Kong based PCB fabricator. The company now operates seven manufacturing sites in Asia.

EI builds bare boards, assemblies, chip packages and enclosures.

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