SAN JOSE -- Fabless chip package designer Tessera Technologies has the inside track to win its patent infringement and antitrust cases against Micron Technology and Infineon Technologies, a Wall Street analyst said Friday.
SG Cowen analyst Raj Seth, in a research note, said recent claims construction in the U.S. District Court for the Eastern District of Texas enhanced Tessera's chances in the suit.

"No doubt claims construction is a critical step in a patent case because it defines the scope/boundaries of a patent . . . That the Texas court chose to stick largely with previous definitions would indicate to us that Tessera's patent claims are solid," he said.

Last March Tessera filed a patent infringement suit against Infineon and Micron. The suit was amended in April to include antitrust claims.

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