Jersey City, NJ  – Cookson Electronics Assembly Materials has established a Global Applications Technology and Engineering group, which will join its global R&D group. The new group’s mission is to help customers solve assembly technology, yield and reliability challenges by understanding process dynamics, and incorporating internal testing and validation capabilities.
 
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing,” said Steve Brown, director of global applications technology. “This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as Pb-free production becomes a daily reality. At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection. This enables us to re-create and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs."
 

• Prev
• Next