HERNDON, VA — iNEMI will hold several meetings at the SMTA International conference this month.

• The SnPb-Compatible BGA Availability workshop, a half-day session on Sept. 28 and sponsored by the iNEMI High-Reliability RoHS Task Force, will focus on what can be done to encourage components suppliers to continue to offer SnPb-compatible BGAs. For more information, go to http://www.inemi.org/cms/calendar/SMTAI_2006_SnPb_BGA.html.
• The SMT Component Packaging Label Standard project meets Sept. 26 to discuss a new project for industry guidelines for SMT product package labeling of automatically placed electronic component packages.
• The Halogen-Free project will hold a planning meeting Sept. 26. The group is working to identify technology readiness, supply capability and standards development opportunities for “halogen-free” alternatives to conventional PWB materials.
• Chuck Richardson, staff manager of roadmapping, will discuss iNEMI’s roadmap development process and provide examples of how the roadmap is used to identify gaps and define projects to address those gaps, on Sept. 26.
• On Sept. 27, iNEMI will launch an effort to investigate of Pb-free defects per million opportunities.
  
• Finally, on Sept. 28, the Life After EU RoHS forum will look at emerging environmental regulations with the goal of identifying collaborative efforts to close policy and technology gaps. 

iNEMI is an industry consortium. Visit iNEMI for additional details. All meetings will be held in the Donald E. Stephens Convention Center in Rosemont (Chicago), IL.

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