SAN JOSE – MEPTEC, the MicroElectronics Packaging and Test Engineering Council, will hold its annual packaging roadmaps symposium Nov. 16 in San Jose.

IC Packaging & Test Roadmaps: Device Trends Impact on Packaging & Test Technology and Supply Chain, the annual roadmap symposium, will overlay IC device trends with the associated current and future technology solutions for packaging and test and will also explore challenges associated with demands for full turnkey supply chain services.

For more information, visit www.meptec.org.

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