-SAN JOSE – NanoNexus CEO Dr. William Bottoms will keynote MEPTEC's IC Packaging and Test Roadmaps symposium next month.

The MEPTEC (the MicroElectronics Packaging and Test Engineering Council) event will be held Nov. 16, at the in San Jose.

Dr. Bottoms is chairman and CEO of NanoNexus, a provider of advanced contactor and interconnect products. He is also chairman of the technology working group for Assembly and Packaging of the International Technology Roadmaps for Semiconductors, and has chaired a number of government committees on industry roadmaps.

According to Dr. Bottoms, the large industry poadmap activities including ITRS, JISSO and iNEMI all share one core element: The transistor is no longer the limiting factor in cost or performance of electronic products.

Moore’s law scaling is nearing its end and assembly and packaging innovation is taking up the slack. New materials, new architectures and innovation in packaging and interconnect technologies are emerging. Driven by a consumer-dominated industry, assembly and packaging innovation will make a greater contribution to progress over the next decade than IC innovation. In his keynote presentation, Dr. Bottoms will share his views of how this progress, supported and enabled by the roadmap activities and the industry-wide cooperation they represent, is a foundation of our continued technical progress and growth.

For more info, visit meptec.org.

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