AUSTIN, TX – The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry, says TechSearch International. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling.

TechSearch offers a new report describing these packaging options, including silicon interposers, fan-out on substrate, and organic solutions such as Intel’s EMIB. Homogeneous packaging solutions such as AMD’s multichip package are also discussed.

The report explains the reason for adoption in each application and provides market projections. A roadmap of future 3-D packaging trends is presented, and new concepts such as Intel’s Foveros are discussed.

Changes in RF package adoption are examined. Antenna-in-Package solutions for 5G are introduced, and a market forecast is provided. A special section examines trends in 3-D printing, highlighting printed antennas.

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