AUSTIN, TX – Fanout wafer-level packages are expected to grow almost 37% from 2018 through 2022, says TechSearch International, while fan-in WLPs are projected to grow at a CAGR of 8.5% for the four-year period.

FO-WLP‘s adoption continues in products ranging from smartphones to automotive. Despite lower growth for smartphones, the number of WLPs per handset is increasing.

WLPs are increasingly adopted in tablets and wearable devices such as smart watches, fitness bands, and virtual reality headsets.

Cost-reduction pressures are driving the development of alternatives to reconstituted wafer FO-WLP in the form of large-area panel processing, and the first product can be seen in the new Samsung smart watch, says TechSearch International.

Cu pillar is increasingly used for many devices. Demand continues for both 300mm and 200mm bumping. Flip chip growth shows an 8.3% CAGR in unit volume from 2018 through 2022.

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