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Multicore MP218 halide-free, no-clean solder paste is optimized for SnPb processes yet compatible with Pb-free device finishes. Is comprised of similar raw materials, activators and other components as used in next generation Pb-free solders. Offers wider reflow capabilities to overcome wetting issues caused by the combination of SnPb solder and Pb-free device finishes.


Is designed to operate under elevated Pb-free temperatures (up to 260°C). Is said to have high humidity resistance. Anti-tombstoning formulation is designed to extend the liquidus time of solder during reflow, increasing the wetting window for each end of the component.


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