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PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
 
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance. 
 
Four different optional finishes available for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.


Each test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions and user manual.


Practical Components Inc., practicalcomponents.com

Indium Corp., indium.com
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