Endicott Interconnect Technologies will exhibit semiconductor packaging solutions at Semicon West, July 10-14, at booth, #5484C in the NY Loves Nanotech pavilion.
 
Semiconductor packaging offerings include HyperBGA, CoreEZ and Wire Bond PBGA. EI will also showcase its PCB fabrication, first- and second-level assembly solutions.
 
HyperBGA is a flouropolymer-based, organic flip-chip package for high performance applications where speed, reliability and increased signal I/O, along with reduced weight and package size, are critical. This low stress flip-chip laminate package is suited to graphics applications that require high data processing speeds or any application requiring a system-in-package approach.
 
CoreEZ uses the HyperBGA manufacturing platform to offer organic, thin core build-up, flip chip technology that combines electrical, reliability and wireability performance with cost effective materials and processes. For applications requiring low-cost build-up materials with high performance, or for aerospace applications requiring radiation tolerance.
 
To expand the market place for CoreEZ, EI entered into a Memorandum of Understanding with Meadville Technologies Group to produce the organic substrates at their Shanghai Silicon Platform facility; qualification builds are currently underway.
 
Wire Bond PBGA offers electrical performance and material properties that are matched to the PCB, to deliver high performance and field reliability. The chip-up design is economical and targets lower power applications while the cavity package provides thermal performance.
 
Endicott Interconnect Technologies, www.endicottinterconnect.com

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