Circuits Assembly Online Magazine - Die Attach Equipment Market to Grow at 6% CAGR through 2024

LYON, FRANCE – The die attach equipment market was worth $979 million in 2018 and will reach $1.3 billion by 2024, a CAGR of 6% between 2018 and 2024, according to Yole Développement.

This growth is expected to be fueled by assembly and packaging opportunities created by semiconductor megatrends, says Santosh Kumar, principal analyst and director packaging, assembly and substrates, Yole Korea.

The FC bonder market will grow at a 12% CAGR to reach $290 million in 2024, whereas the die bonder market will grow at a 5% CAGR to reach $1.09 billion in 2024. By application, the highest growth is in the stacked memory bonder market, with a 24% CAGR, followed by optoelectronics, with a 12% CAGR, and logic, with an 8% CAGR.

Today’s semiconductor megatrends include mobile devices, big data, AI, 5G wireless networking, HPC, IoT including industrial IoT, smart automotive, industry 4.0, and data centers. These applications create demand for electronics hardware, which requires high computing power, high speed, more bandwidth, low latency, low power, more functionality, more memory, system-level integration and a variety of sensors. Such trends create business opportunities across various electronic device packaging platforms. However, advanced packaging has one of the best opportunities, as it can fulfill various performance and complex heterogeneous integration requirements.

The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends.

In terms of technology, epoxy bonding dominates die attach for wire-bond packaging, and related die bonders constituted around 85% of the total bonder market in 2018. However, epoxy bonding’s share will reduce to 53% by 2024. Eutectic bonding growth is driven by MEMS, high power LEDs and optoelectronics applications. C2W hybrid bonding is the emerging promising technology that can enable direct Cu- Cu bonding and has potential to replace TCB for the 3-D stacked memory and high-end logic application. However, C2W hybrid bonding is still in its early stages and is expected to hit the market in 2021 for stacked memory and in 2022/23 for logic devices with 2.5-D structures.