QX500 AOI has improved cycle times. Now includes SIM, enabling on-the-fly inspection. 
 
SE500-X 3-D solder paste inspection now accommodates boards/panels measuring 100 x 100 mm up to 810 x 610 mm. SE500 and SE500-X 3-D can inspect pad sizes down to 01005.
 
CyberOptics Corp., www.cyberoptics.com

NL930 Pb-free, no-clean solder paste is said to feature good solderability, improve stencil life and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index and wetting characteristics. Post-reflow flux residues are penetrable. Is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes, and with OSP, ENIG, immersion silver, and immersion tin finishes. Features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as good response to one-hour pause after two knead strokes at 35-65% RH.
 
FCT Assembly, www.fctassembly.com

VP4000 4-channel vapor phase temperature profiler has a low mass, hermetically sealed RF data-logger with heat-shield, measuring 130 x 60 x 40 mm. Is capable of passing directly through the preheat, vapor reflow and vacuum stages. Profile data are continuously passed to a PC via two-way wireless RF link. Profile can be viewed in real time as boards are being soldered.
 
AutoSeeker automatic reflow process optimization software reportedly eliminates trial-and-error approach. Given a user profile, it uses a rules-based algorithm to search for the best machine settings. User criteria such as process window centered, fastest throughput or lowest running costs can be defined.
 
Solderstar Pro RF wave and reflow profiling is for reflow and wave solder temperature profiling. This scalable system permits reflow profiling on 6, 9, 12 or 16 channels. When used in conjunction with the Waveshuttle wave solder process analyzer, it forms a wave analysis tool capable of detailed wave temperature profile and wave contact measurements. Incorporates an ultra-compact RF data-logger that provides a two-way RF data link with a PC. Permits system setup, process improvements and data downloads to be performed efficiently and temperature profile to be analyzed in real time.
 
SolderStar Ltd., www.solderstar.eu

ER2218 epoxy resin is a two-part encapsulation compound designed to meet UL94 flame retardency. Incorporates a novel flame retardant, resulting in an low viscosity flame retardant formulation. Is RoHS-compliant and non-halogenated and free of aromatic amines. Adheres to a variety of substrates, exhibits resistance to water and a variety of chemicals. Is reflow compatible. Comes in resin packs for air-free mixing of small volumes. Bulk product and resin kits will also be available for larger volumes.

Electrolube, www.electrolube.com

CPJ+ reduces process variability to maintain a constant Takt time by ensuring consistent flow rates for applications such as underfill with tight keep-out zones, and sealing applications. With Fluidmove software, integral electro-pneumatic regulators, and precision weigh scale, CPJ+ is said to automatically compensate for both fluid viscosity changes over time as well as batch-to-batch variations. Reportedly increases dispense accuracy for higher yields and ensures a highly repeatable process, minimizing setup-to-setup and line-to-line variation, while eliminating operator interaction.

Asymtek, www.asymtek.com

XPii comes with one or two placement heads, 8 or 12 nozzles, tape or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Features linear motors, high resolution digital cameras, turret head(s) and intelligent feeders. On-head optical sensors detect presence of components as small as 01005 and as large as 50 x 50 mm on-the-fly. Handles components up to 70 x 70 mm and 100 mm connectors with fixed camera option. Accommodate components on tape, strip tape, stick and matrix tray. Gantry platform has a 40 position "smart: nozzle bank (2 x 40) or (1 x 40 + 1 x 20 + 1 special) optional. Reportedly places at rates up to 13,500 cph (11,340 cph based on IPC-9850), or 15,000 cph (12,800 cph IPC-9850) with Tornado head

Europlacer, www.europlacer.com

Vigon N 501 pH-neutral defluxing cleaning agent ensures compatibility with sensitive SMT production materials such as aluminum, copper, brass, nickel, plastics and label materials. Is a water-based, non-flammable MPC (micro phase cleaner) specifically developed for spray-in-air processes. Has short contact times and bath concentration levels as low as 10 – 15%.

Zestron, www.zestron.com

The Yamaha YS24 pick-and-place machine is a dual-sided machine with a total of 120 feeder positions in a space of 2 m2. Has speed up to 72,000 components per hr. Performs placement of components ranging from 0.4 mm by 0.2 mm (01005) up to 32 sq. mm. Handles board sizes up to 700 mm long by 460 mm wide. Includes NPI features like virtual sticky tape, easy editors and setup assistant.

Assembléon, www.assembleon.com

RemUVa is designed to remove coatings from finished assemblies. Has a fully configurable nozzle to permit working on smaller areas or to remove coating across a larger area. Reportedly does not damage adjacent devices, interconnects or PCBs. Is a bench-top powder abrasion system designed to remove conformal coatings, including UV40. Is equipped with adjustable powder flow control and air pressure regulation. Uses an abrasive media known as carbo-blast. Uses a point ionizer to reduce ESD from reaching levels that could potentially damage components. 

HumiSeal, www.humiseal.com

Camalot SmartStream non-contact dispense pumps now come with optional Dual Head Synchronous Mode. Synchronous dispense mode said to improve throughput by 50% while eliminating risk of poor yields/scrapped product experienced by alternative approaches to simultaneous dispensing on multi-up circuits. Is capable of detecting panel rotation and will automatically switch to an asynchronous dispense mode to ensure that both heads dispense accurately on the PCBs within the skewed panel. New software algorithms ensure dual pumps are pitched correctly and have identical flow rates. Is compatible with the Camalot XyflexPro+ and FX-D dispense systems and may be retrofitted in the field.

Speedline Technologies, www.speedlinetech.com

A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.

Heraeus Thick Films Materials Business Unit, www.heraeus.com

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com