DCA-FD is a modified silicone conformal coating said to dry to the touch in 20 min. Increased solids content reportedly gives 35% greater coverage per liter compared to standard DCA. Has a wide operating temperature range and is suitable for a range of commercial and high-rel applications. Has lower VOC levels compared to standard DCA. Has excellent adhesion and is resistant to most solvents, lubricants and chemicals. Is highly resistant to mold growth and UV light. Can be sprayed, dipped or brushed. Is RoHs-compliant and meets UL746CQMJU2, DEF-STAN 59/47(4), and IPC-CC-830.
 
Electrolube, www.electrolube.com

MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
 
Assembléon, www.assembleon.com

 

Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window. 
 
Henkel, www.henkel.com/electronics

 

Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.

Siemens Electronics Assembly Systems, www.siplace.com

 

Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%. 

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.
 
SEHO Systems GmbH, www.sehona.com

 

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
 
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
 
Koki Co. Ltd., www.ko-ki.co.jp

 

M22X DL-18/460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D solder paste inspection. Handles medium and large PCBs. Features high-speed digital XGA color camera, as well as analysis via synthetic imaging. Combines speed and accuracy of CL systems with a new lighting concept. Three pulse wave modulated LED light sources (main, side and DOAL) can lighten inspection points from three different angles. Up to six different lighting combinations are available.
 
Marantz, www.escapethegrayworld.com 

Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
 
DEK, www.dek.com