SN100C P600 D4 is a halogen-free, no-clean, Pb-free solder paste that contains no fluorine, chlorine, bromine or iodine. Is said to be high reliability, for high-density assembly with stable printability; reflows easily with good wetting and minimum incidence of mid-chip balling, and low residue. Can be reflowed with profiles similar to SAC 305 and SAC 405 with 240°C peak.
 
Nihon Superior, www.nihonsuperior.co.jp/english/ 

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